发明名称 COMPONENT MOUNTING DEVICE
摘要 <p>In the related art, a mounting error of a component mounting device was what was allowed by a required mounting accuracy. However, in the present invention, it has been found that the required mounting accuracy increases significantly as high-density mounting is required later for a component mounting device. In other words, it has been found that the required mounting accuracy increases to the point that the mounting error, which has been allowed to date, is no longer allowable. The present invention purports to resolve the above-described problem by obtaining an image including at least one of a position where a component is to be mounted on a substrate and a tip of a nozzle shaft, and performing component mounting.</p>
申请公布号 WO2013161878(A1) 申请公布日期 2013.10.31
申请号 WO2013JP62078 申请日期 2013.04.24
申请人 HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 TAKAHIRA ISAO;SAEGUSA TAKASHI;INOUE TOMOHIRO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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