发明名称 DEVICE AND METHOD FOR PROCESSING WAFERS
摘要 PROBLEM TO BE SOLVED: To optimize processing of substrates and also to avoid contamination, damage, fouling or oxidation as much as possible.SOLUTION: A device (1) for processing a plurality of substrates or substrate pairs comprises at least one pretreatment module (9) and at least one aftertreatment module (11). The pretreatment module and the aftertreatment module are coupled to a primary treatment module (10). The primary treatment module forms a pressure-tight lock to the neighboring pretreatment module and/or to the neighboring aftertreatment module.
申请公布号 JP2013225706(A) 申请公布日期 2013.10.31
申请号 JP20130153406 申请日期 2013.07.24
申请人 EV GROUP GMBH 发明人 PAUL LINDNER;PETER-OLIVER HANGWEIER
分类号 H01L21/02;H01L21/677 主分类号 H01L21/02
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