RESIN COMPOSITION, METAL FOIL WITH RESIN LAYER, METAL CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD

摘要

The purpose of the present invention is to provide a resin composition, etc. that have superior electrical characteristics such as high-frequency characteristics required for materials for manufacturing printed wiring boards and also can form a resin layer having suitable solubility in a desmearing solution. To achieve this purpose, the resin composition that constitutes a resin layer of a laminate, said resin layer being provided on the surface of a metal layer, is constituted so as to contain 10 - 100 parts by mass of a styrene butadiene block copolymer and 0.1 - 100 parts by mass of a desmearing solution dissolution promoting component to 100 parts by mass of a polyphenylene ether compound.