| 摘要 |
A level clip is disclosed for securing along the edge of a wall-hanging substrate for the purpose of leveling the substrate. The clip includes a body having a substrate-receiving slot and a contact surface. The clip also supports a bubble level so that it is aligned with the contact surface. The user inserts the edge of the substrate into the slot so that the edge of the substrate abuts evenly with the contact surface, thereby allowing the bubble level to convey level-alignment information in response to rotational movement of the substrate. Resilient outer arms adjacent to the slot create friction to help hold the clip in place.
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