INTEGRATED CIRCUIT DEVICE PACKAGES AND METHODS FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE PACKAGES

摘要

The laminated flexible integrated circuit device package according to the present invention may include: a flexible substrate; a first flexible integrated circuit device having a first connection pad; a second flexible integrated circuit device having a second connection pad; a connection wire electrically connecting the first and second connection pads to an external device; and a flexible protection member disposed on the second flexible integrated circuit device. The laminated flexible integrated circuit device package according to the present invention may include: a flexible substrate; a first flexible integrated circuit device having a first connection pad; a second flexible integrated circuit device having a second connection pad; a connection wire electrically connecting the first and second connection pads to an external device; and a flexible protection member disposed on the second flexible integrated circuit device.