| 摘要 |
A process for manufacturing an encapsulated OLED device, which includes, after encapsulation of the device, a step of ultrasonic soldering at a first edge of the lower electrode, forming a lower electrical connection zone with a solder pad extending from the encapsulation surface as far at least as the surface of the lower electrode, and/or a step of ultrasonic soldering in an upper electrical connection zone with a solder pad extending from the encapsulation surface as far at least as the surface of the upper electrode. |
