| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element manufacturing method which can inhibit cracks and chips of a sapphire substrate in a grinding and polishing process of the sapphire substrate in a manufacturing process of a semiconductor element; and provide a semiconductor element manufactured by the manufacturing method.SOLUTION: A semiconductor element manufacturing method of manufacturing a semiconductor element by performing a plurality of processes on a warped sapphire substrate 10 which includes an apex on the side of a surface 10A having a semiconductor layer 11, comprises: a wet blast process of wet blasting a rear face 10B of the sapphire substrate 10; a bonding process, after the wet blast process, of bonding the surface 10A of the sapphire substrate 10 to a substrate holding member 300 for holding the sapphire substrate 10; and a grinding and polishing process, after the bonding process, of grinding and polishing the rear face 10B of the sapphire substrate 10 to a predetermined thickness. |
