| 发明名称 |
THERMOELECTRIC MATERIAL HAVING REDUCED THERMAL CONDUCTIVITY, AND THERMOELECTRIC DEVICE AND MODULE INCLUDING THE SAME |
| 摘要 |
A thermoelectric material including: a thermoelectric matrix including grains with a composition of Formula 1: (BixSb1-x)a(TeySe1-y)bFormula 1 wherein 1.8@a@2.2, 2.8@b@3.2, 0@x@1, and 0@y@1, and wherein a plurality of dislocations is present along a grain boundary between adjacent grains of the composition of Formula 1.
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| 申请公布号 |
US2013284967(A1) |
申请公布日期 |
2013.10.31 |
| 申请号 |
US201313871246 |
申请日期 |
2013.04.26 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SANG-IL;LEE KYU-HYOUNG;HWANG SUNG-WOO;AHN KYUNG-HAN |
| 分类号 |
H01L35/18 |
主分类号 |
H01L35/18 |
| 代理机构 |
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