PACKAGE FOR MOUNTING LIGHT EMITTING ELEMENT, MANUFACTURING METHOD OF THE SAME, AND LIGHT EMITTING ELEMENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a package for mounting a light emitting element which includes a heat radiation path efficiently transmitting heat generated by the light emitting element to a heat radiation part provided at the exterior and a manufacturing method of the package for mounting the light emitting element, and to provide a light emitting element package where the light emitting element is mounted on the package for mounting the light emitting element and the heat radiation part is included.SOLUTION: A package for mounting a light emitting element includes: a substrate; wiring provided on one surface of the substrate and forming a light emitting element mounting part on which the light emitting element is mounted; and penetration wiring that penetrates through the substrate, the penetrating wiring where one end is electrically connected with the light emitting element mounting part and the other end protrudes from the other surface of the substrate and forms a connection terminal. The light emitting element mounting part includes two regions which are arranged so as to face each other and be spaced a predetermined distance away from each other in a plane view. The penetrating wiring is provided in each of the two regions. A connection part connected with one electrode of the light emitting element is formed in one of the two regions, and a connection part connected with the other electrode of the light emitting element is formed in the other of the two regions.