发明名称 LIQUID-COOLED-TYPE COOLING DEVICE AND MANUFACTURING METHOD FOR SAME
摘要 A liquid-cooled-type cooling device includes a casing having a top wall, a bottom wall, and a cooling-liquid passage, and a radiating member disposed in the cooling-liquid passage. The radiating member has a substrate and a plurality of pin-shaped fins. Longitudinally intermediate portions of the pin-shaped fins are brazed to the substrate. The substrate has a plurality of fin insertion holes, and the pin-shaped fins are inserted into the fin insertion holes of the substrate. A plurality of convex portions are integrally formed on the longitudinally intermediate portion of each pin-shaped fin. The substrate and the pin-shaped fins are provisionally fixed together by plastically deforming the convex portions such that they are crushed. In this state, the substrate and the pin-shaped fins are brazed together. The upper and lower end portions of the pin-shaped fins are brazed to the top wall and bottom wall, respectively, of the casing.
申请公布号 US2013284404(A1) 申请公布日期 2013.10.31
申请号 US201213670809 申请日期 2012.11.07
申请人 SHOWA DENKO K.K. 发明人 MATSUSHIMA SEIJI;TOMITA KOUJI
分类号 F28F1/40;B23P15/26 主分类号 F28F1/40
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