发明名称 FET e.g. planar FET, for use in memory cell of microprocessor, has crystalline silicon substrate comprising surface, and source or drain regions formed on surface, which surrounds channel portion along length of channel portion
摘要 <p>The FET (200) has a crystalline silicon substrate (20) i.e. wafer, comprising a surface and made of diamond or germanium. A channel portion is formed over the surface. The channel portion comprises another surface with certain height over the former surface and certain length parallel to the former surface. Two source or drain regions are formed on the former surface, which surrounds the channel portion along the length of the channel portion. The substrate comprises fin- and/or ridge structures (202a, 202b) in two regions (20a, 20b). An independent claim is also included for a method for manufacturing a FET.</p>
申请公布号 DE102013100904(A1) 申请公布日期 2013.10.31
申请号 DE201310100904 申请日期 2013.01.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 YUAN, FENG;PENG, CHENG-YI;WANN, CLEMENT HSINGJEN;LEE, TSUNG-LIN;YEH, CHIH-CHIEH
分类号 H01L29/78;H01L21/336;H01L21/8238;H01L27/092;H01L29/12 主分类号 H01L29/78
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