<p>The present invention relates to a method for easily measuring the interfacial adhesion of a film by inducing a preliminary crack on a substrate and then using same to peel off the film from the substrate. The method according to one aspect of the present invention comprises: a step of placing an indenter on the surface opposite the surface of a test material that is the substrate on which a predetermined film is formed; a step of forming a crack on the substrate by applying a first indentation load to the test material using the indenter; a step of measuring the surface adhesion of the film by applying a second indentation load from the other surface of the portion of the test material where the crack is formed and peeling the substrate and the film apart from each other.</p>
