| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state device which achieves excellent heat radiation performance of a solid state component connected with a metal pattern by a conductive bump, and to provide a manufacturing method of the solid state device.SOLUTION: A solid state device 10 according to one embodiment of the invention includes: a metal pattern 11 formed on a substrate 2; a conductive bump 3 connected with the metal pattern 11 so as to contact with a side surface 11s of the metal pattern 11; and a solid state component 4 connected with the metal pattern 11 through the conductive bump 3. A height of at least a part of a bottom surface of the conductive bump 3 is equivalent to a height of a bottom surface of a portion in the metal pattern 11 to which the conductive bump 3 is connected. |
