发明名称 FORMING DIE OF ELECTROFORMING COMPONENT AND METHOD FOR MANUFACTURING ELECTROFORMING COMPONENT
摘要 PROBLEM TO BE SOLVED: To manufacture a solid electroforming component easily at low cost.SOLUTION: A forming die 10 of an electroforming component W is provided including a metal electrode plate 1 that has on one surface 1a thereof an electrode plane region 5 where the electroforming component W is formed by electroforming processing; and a resin-made coating 3 that has around the electrode plane region 5 a through hole 7 constituting an inner wall 7a rising from the electrode plane region 5, and makes the electrode plane region 5 of the metal electrode plate 1 be exposed to coat the one surface 1a. The electrode plate 1 and the coating 3 are integrally molded.
申请公布号 JP2013224483(A) 申请公布日期 2013.10.31
申请号 JP20130032055 申请日期 2013.02.21
申请人 SEIKO INSTRUMENTS INC 发明人 MATSUMURA HIROAKI;NIWA TAKASHI;MASUI YASUYUKI
分类号 C25D1/10;C25D1/00;C25D1/20 主分类号 C25D1/10
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