发明名称 |
FORMING DIE OF ELECTROFORMING COMPONENT AND METHOD FOR MANUFACTURING ELECTROFORMING COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a solid electroforming component easily at low cost.SOLUTION: A forming die 10 of an electroforming component W is provided including a metal electrode plate 1 that has on one surface 1a thereof an electrode plane region 5 where the electroforming component W is formed by electroforming processing; and a resin-made coating 3 that has around the electrode plane region 5 a through hole 7 constituting an inner wall 7a rising from the electrode plane region 5, and makes the electrode plane region 5 of the metal electrode plate 1 be exposed to coat the one surface 1a. The electrode plate 1 and the coating 3 are integrally molded. |
申请公布号 |
JP2013224483(A) |
申请公布日期 |
2013.10.31 |
申请号 |
JP20130032055 |
申请日期 |
2013.02.21 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
MATSUMURA HIROAKI;NIWA TAKASHI;MASUI YASUYUKI |
分类号 |
C25D1/10;C25D1/00;C25D1/20 |
主分类号 |
C25D1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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