| 摘要 |
PROBLEM TO BE SOLVED: To maintain surface tension while securing area for a solder pull land, and to maintain force for pulling excessive solder away from a soldering land group.SOLUTION: A printed wiring board is provided with a side solder pull land 3 which is provided at a corner part behind a front soldering land group 2 and before a rear soldering land group 4 and also shaped extending to behind the front soldering land group 2 in an arrangement direction, and collects solder, and a rear solder pull land 5 which is provided at a corner part behind two rear soldering land groups 4 and shaped extending to behind the printed wiring board in a movement direction, and collects solder, at least one of the side solder pull land 3 and rear solder pull land 5 being provided with circular resist 6 repelling solder. |
