| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition, particularly a high-impact-resistive thermosetting epoxy resin composition, which has excellent storage stability at room temperature, and exhibits quick curing at a temperature of 160 to 170°C.SOLUTION: A thermosetting epoxy resin composition has features of, particularly, high impact strength, excellent storage stability and low curing temperature. The epoxy resin composition is especially suitable in use as a structural shell adhesive and for production of a structural foam. These can be cured even under the so-called post-bake condition. Further the use of a reaction promoter of formula (Ia) or (Ib) increases the impact strength of the thermosetting epoxy resin composition. |
