发明名称 TEST SUPPORT METHOD, TEST SUPPORT PROGRAM, AND TEST SUPPORT DEVICE
摘要 PROBLEM TO BE SOLVED: To facilitate determining whether a defect in power supply wiring has occurred in a semiconductor integrated circuit.SOLUTION: A test support device 100 specifies cells within first circuit information 101, which indicate elements where a failure may occur due to a defect at a specific position of power supply wiring within the semiconductor integrated circuit 103, and the kinds of failures, in the first circuit information 101 that indicates a connection relationship of elements within the semiconductor integrated circuit 103. The test support device 100 provides a simulator with the first circuit information 101 after failure models associated with the kinds of failures for the specified cells are set and a test pattern t1, so as to execute simulation. The test support device 100 obtains a result of a test that is performed by providing the test pattern t1 to the semiconductor integrated circuit 103. The test support device 100 determines whether a second simulation result 102 and a test result 1000 match with each other.
申请公布号 JP2013224829(A) 申请公布日期 2013.10.31
申请号 JP20120096122 申请日期 2012.04.19
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 HIRAMATSU TETSUYA;KATO TAKAYUKI;MURAKAMI TAKAKO
分类号 G01R31/28;G06F17/50 主分类号 G01R31/28
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