| 摘要 |
An image pickup apparatus which is capable of fixing an image pickup device compactly and with high strength. A wiring substrate has an image pickup device mounted thereon. A fixing member is fixed on the image pickup device. The fixing member is provided with an abutment surface that comes into abutment with the image pickup device, an opening from which a light-incident surface of the image pickup device is exposed, and a wall portion that faces a side surface of the image pickup device. An adhesive is filled in a space formed between the side surface of the image pickup device and the wall portion.
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