| 发明名称 |
CONNECTION STRUCTURE, WIRING SUBSTRATE UNIT, ELECTRONIC CIRCUIT PART UNIT, AND ELECTRONIC APPARATUS |
| 摘要 |
A connection structure includes a column electrode; a first connecting portion connected to one end of the column electrode; and a second connecting portion connected to another end of the column electrode via solder, wherein a height of the column electrode is a width of the first connecting portion or greater. |
| 申请公布号 |
US2013284509(A1) |
申请公布日期 |
2013.10.31 |
| 申请号 |
US201313867188 |
申请日期 |
2013.04.22 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA KEI;NAKAZAWA SHINJI;SUZUKI MIKI |
| 分类号 |
H01R12/00;H01R4/02 |
主分类号 |
H01R12/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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