<p>A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10: 1 such as to minimize the thermal residual stresses of the cured product made from the curable composition.</p>
申请公布号
WO2013162840(A1)
申请公布日期
2013.10.31
申请号
WO2013US35106
申请日期
2013.04.03
申请人
DOW GLOBAL TECHNOLOGIES LLC
发明人
BALIJEPALLI, BHARATI;THEOFANOUS, THEOFANIS;HOEVEL, BERND;VERGHESE, KANDATHIL, E.;PHAM, HA, Q.