PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID-CRYSTAL DISPLAY DEVICE

摘要

Provided is a photosensitive resin composition having high sensitivity, high transparency, high chemical resistance, high adhesion with a curing-film substrate, and exceptional dry-etching resistance, and enabling a low-permittivity curing film to be obtained. A photosensitive resin composition containing: (A) a polymer component including a polymer fulfilling at least one of (1) and (2): (1) a polymer having (a1) a structural unit in which an acid group has a residue protected by an acidolytic group, and (a2) a structural unit having a cross-linking group; (2) (a1) a polymer having a structural unit in which an acid group has a residue protected by an acidolytic group, and (a2) a polymer having a structural unit having a cross-linking group; (B) a photo-acid-generating agent; (C) an adduct-type block polyisocyanate compound; and (D) a solvent.