| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board that achieves high-density wiring while reducing radiation noise by having a configuration ensuring a return current path for a signal current.SOLUTION: A printed circuit board includes a first semiconductor package mounted on a first surface layer of a printed wiring board and a second semiconductor package mounted on a second surface layer of the printed wiring board, and transmits a bus signal from the first semiconductor package to the second semiconductor package. A first bus wiring path from signal terminals on an inner peripheral side of the first semiconductor package to signal terminals on an inner peripheral side of the second semiconductor package through vias and the second surface layer, and a second bus wiring path from signal terminals on an outer peripheral side of the first semiconductor package to signal terminals on an outer peripheral side of the second semiconductor package through vias and the second surface layer are provided in the printed circuit board. |
