Micro-electromechanical device e.g. micro-electromechanical sensor such as inertial sensor, has electrically conductive metallization portion which is arranged on surface of substrate and is partially formed of chemically active getter

摘要

The micro-electromechanical device (3) has a substrate (1) having several micro-electromechanical structures (3a) arranged on the substrate surface. An electrically conductive metallization portion (4b) is arranged on the surface of the substrate and is partially formed of chemically active getter. The electrically conductive metallization portion is the top metallization portion of the micro-electromechanical device. Independent claims are included for the following: (1) micro-electromechanical chip package; and (2) method for manufacturing micro-electromechanical chip package.