| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device including a plurality of stacked semiconductor chips, which can improve productivity and reliability.SOLUTION: A manufacturing method of a semiconductor device including a plurality of semiconductor components and a plurality of resin layers comprises: a process of alternately stacking resin layers 17, 15, 13, 11 and semiconductor components 16, 14, 12, 10 on a base material 18 one by one and performing heating at a temperature lower than a temperature at which a solder layer of a base material and/or the semiconductor component melts and applying pressure to perform bonding; and a process of performing heating at a temperature equal to or higher than the temperature at which the solder layer melts and applying pressure. |
