| 摘要 |
A method and apparatus for processing substrates using a multi-chamber processing system that has an increased throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in vertical and horizontal directions, to access the various processing chambers retained in the processing racks. In one embodiment, a robot blade is adapted to restrain a substrate so that the accelerations experienced by the substrate during a transferring process will not cause the substrate position to change on the robot blade.
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