| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board, which forms the circuit board with high precision on an insulation base material, even for an electrical circuit having a narrow line width and a line interval. SOLUTION: The manufacturing method of a circuit board includes: a film formation process to form a resin film 2 in the surface of the insulation base material 1; a circuit pattern formation process to form a circuit pattern portion of a circuit groove 3 of a predetermined shape and depth by applying laser processing or machine processing to the insulation base material 1 from the outside surface of the resin film 2; a catalyst adhesion process to adhere a plating catalyst or its precursor 5 to the surface of the circuit pattern portion and the surface of the resin film 2; a film peeling process to peel off the resin film 2 from the insulation base material 1; and a plating processing process to apply electroless plating to the insulation base material 1 of which the resin film 2 is peeled off. The film formation process uses, as the insulation base material 1, a material which has a smooth surface having a 0.5 μm or less surface roughness (Ra), and the resin film 2 is formed on the smooth surface side. COPYRIGHT: (C)2011,JPO&INPIT
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