| 摘要 |
The invention relates to a manufacturing method for a printed circuit board (PCB) with an insulated micro radiator. Comparing with the manufacturing method for a conventional PCB, the method adds a step that: one or more one high thermal conductivity insulated micro radiators in cylindrical shape is embedded into the PCB, and heating component is provided on the top copper pattern of one or a number of insulated micro radiators. The invention combines the high thermal conductivity insulated micro radiator with a conventional rigid PCB. The PCB has the advantages of high thermal conductivity and heat transfer stability of the insulated micro radiator as well as the advantages of flexible routing and reliable electrical connection of the conventional PCB. Moreover, it can transmit the heat generated by the heating components such as LED components and so on out of the PCB during operation, timely and effectively. Therefore, it is an ideal carrier board for the heating component and an array thereof. The manufacturing method has the advantages of simple, convenience for operation and high productivity. |
