| 摘要 |
A method of preparing a non-ferrous metal substrate for plating includes providing an anodized layer on an aluminum substrate and electrically isolating the anodized layer from the non-ferrous metal substrate by applying an electrically non-conductive micro-filler to the anodized layer to form a filled region of the anodized layer electrically isolating the anodized layer from the non-ferrous metal substrate. |
