<p>PLATING BATH AND METHODAbstract of the DisclosureSilver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.NO FIGURE</p>
申请公布号
SG193763(A1)
申请公布日期
2013.10.30
申请号
SG20130023551
申请日期
2013.03.28
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC;DOW GLOBAL TECHNOLOGIES LLC