发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE AND RECORDING MEDIUM
摘要 PURPOSE: A method for manufacturing a semiconductor device, a substrate processing method, a substrate processing device, and a recording medium are provided to improve resistance to etching by using a carbon layer. CONSTITUTION: A heating device comprises a heater (207). The heater is vertical to a heater base. A reaction tube (203) is arranged in the heater. Nozzles are arranged in a process chamber (201). An organic gas is supplied into the process chamber.
申请公布号 KR20130118770(A) 申请公布日期 2013.10.30
申请号 KR20130028939 申请日期 2013.03.19
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 TAKEDA TSUYOSHI;SATO TAKETOSHI;KOHASHI MINORU
分类号 H01L21/31;H01L21/205 主分类号 H01L21/31
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