LIGHT EMITTING DEVICE, METHOD FOR FABRICATING THE SAME, AND LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device, a manufacturing method thereof, and a light emitting device package are provided to prevent a power drop due to a zener diode by removing the zener diode. CONSTITUTION: A light emitting structure layer (120) includes a first conductive semiconductor layer (117), a second conductive semiconductor layer (123), and an active layer (119). A first electrode (141) is electrically connected to the first conductive semiconductor layer. A second electrode (151) is electrically connected to the second conductive semiconductor layer. The second electrode includes a discharge part (152) corresponding to the first electrode. The discharge part of the second electrode spatially corresponds to the first electrode by a hollow part (25).