| 摘要 |
PROBLEM TO BE SOLVED: To prevent a defect in joining, etc., due to non-fusion of solder on a lower surface of a semiconductor device when a leadless type semiconductor device is soldered without contacting. SOLUTION: Groove portions 3 and 6 are provided adjacently to a plurality of terminal electrodes 4 on a side surface of the leadless type semiconductor device 1 and a terminal electrode 4 of an outermost portion. The terminal electrodes 4 of the semiconductor device 1 extend from the side surface to the bottom surface (lower surface) of the semiconductor device 1 and solder 5 supplied to a land 12 of a printed wiring board 11 is heated to join the respective terminal electrodes 4 to the land 12. The groove portions 3 and 6 adjacent to the terminal electrodes 4 are irradiated with laser beam 8 heating the solder 5 to preheat solder paste on the lower surface of the semiconductor device 1, thereby preventing a joining defect. COPYRIGHT: (C)2010,JPO&INPIT
|
