Thermoelectric material having reduced thermal conductivity

摘要

Provided are a high efficiency thermoelectric material and a thermoelectric device and module including the same. The thermoelectric material forms high-density interface dislocation between a thermoelectric matrix and a metal additive or in the grain boundary, thereby decreasing thermal conductivity. Accordingly, the thermoelectric material can provide improved thermoelectric performance and can be used in various thermoelectric devices.