| 发明名称 |
TAPE HOLDING MECHANISM, SHEET PEELING APPARATUS, AND SHEET PEELING METHOD |
| 摘要 |
<p>PURPOSE: A tape holding mechanism, a sheet peeling device, and a sheet peeling method are provided to prevent the contamination of the surface of a wafer by using a back grind tape. CONSTITUTION: A moving part (2) moves a tape holding part (3). The moving part is bonded to a sheet by electrostatic attraction. A controller (4) controls the operation of the moving part. The tape holding part holds a peeling tape. The peeling tape has a lower surface bonded to the sheet. [Reference numerals] (1) Sheet separation device; (2) Moving part; (3) Tape holding part; (4) Controller</p> |
| 申请公布号 |
KR20130118778(A) |
申请公布日期 |
2013.10.30 |
| 申请号 |
KR20130040969 |
申请日期 |
2013.04.15 |
| 申请人 |
NEC ENGINEERING, LTD. |
发明人 |
TAGA YOICHIRO;NISHIWAKI KAZUMASA;CHIDA MASAO |
| 分类号 |
H01L21/304;H01L21/301;H01L21/677 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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