发明名称
摘要 A printed wiring board includes ground layers stacked via insulator(s), a first through hole, second through holes and signal wirings, each signal wiring extending from the first through hole through the clearance between predetermined ones of the ground layers, and disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring a layer in which the signal wiring is disposed has an outline such that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that the outline of second clearance does not contact with the second through holes.
申请公布号 JP5326455(B2) 申请公布日期 2013.10.30
申请号 JP20080239675 申请日期 2008.09.18
申请人 发明人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
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