BONDING METHOD, BONDING STRUCTURE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT

摘要

To provide a joining method and a joint structure with which a first metal member can be joined to a second metal member while securing sufficient joint strength, and flow out of a joining material at a second reflow stage in bonding with temperature hierarchy can be inhibited/prevented. In joining a first metal member 11a having at least a surface made of a first metal to a second metal member 11b having at least a surface made of a second metal with a joining material 10 sandwiched therebetween, which includes a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound 12 with the low melting point metal composing the joining material, and which has a lattice constant difference of 50% or more from the intermetallic compound, and the joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.