发明名称 STORAGE-STABLE HEAT-CURABLE GRANULAR MATERIAL MIXTURE
摘要 <p>Heat-curing granulate mixture comprises: (a) a first granulate comprising at least one solid epoxy resin having an average of more than one epoxide group per molecule; (b) a second, epoxide-free granulate comprising at least one heat-activatable accelerator for curing a solid epoxy resin with dicyandiamide, at least one thermoplastic, which is solid at room temperature and has a softening point at 70-140[deg] C measured by the ring and ball method according to DIN EN 1238; (c) dicyandiamide; and (d) at least one heat-activatable foaming agent. Heat-curing granulate mixture comprises: (a) a first granulate comprising at least one solid epoxy resin having an average of at least one epoxide group per molecule; (b) a second, epoxide-free granulate comprising at least one heat-activatable accelerator for curing a solid epoxy resin with dicyandiamide, at least one thermoplastic, which is solid at room temperature and has a softening point at 70-140[deg] C measured by the ring and ball method according to DIN EN 1238; (c) dicyandiamide, which is part of the first and/or the second granulate; and (d) at least one heat-activatable propellent, which is independent of each part of the first and/or the second granulate. Independent claims are also included for: (1) producing a molding comprising (i) feeding a heat-curing granulate mixture into a heatable conveyor, (ii) heating the granulate mixture to a temperature above the softening temperature of the pellet mixture and below the activation temperature of the propellant, which is below the activation temperature of the heat-activatable accelerator to form a paste-like heat-curing composition, (iii) introducing a molding into a mold or extruding and (iv) cooling the molding to room temperature; (2) a molding produced by the above mentioned method; (3) producing a structural foam, comprising heating the heat-curing granulate mixture or the molding to a temperature, which is above the activation temperature of the heat-activatable propellant; (4) reinforcing hollow structures comprising introducing the heat-curing granulate mixture or the molding into a hollow structure, heating the heat-curing or granulate mixture or the molding at a temperature which is above the activation temperature of the heat-activatable propellant, forming a foam, and curing of the foam, where the steps are carried out together simultaneously or sequentially; and (5) a reinforced hollow structure obtained by the above mentioned method.</p>
申请公布号 EP2655470(A1) 申请公布日期 2013.10.30
申请号 EP20110805487 申请日期 2011.12.20
申请人 SIKA TECHNOLOGY AG 发明人 FRICK, KARSTEN;BORDEANU, NICOLAE;HOEFFLIN, FRANK
分类号 C08G59/40;B32B3/26;C08G59/68;C08J5/08;C08J9/22;C08L63/00;C09J163/00 主分类号 C08G59/40
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