| 摘要 |
PURPOSE: A light emitting device package and a light emitting apparatus including the same are provided to reduce stress due to the optical output of a light emitting chip by separating the adjacent surface of the light emitting chip from a cavity. CONSTITUTION: A body (11) includes a first lateral surface (S1), a second lateral surface (S2), a third lateral surface (S3), a fourth lateral surface (S4), and a cavity (21) with an upper surface which is opened. A first lead frame (31) and a second lead frame (41) are separately arranged on the bottom of a cavity. A light emitting chip (101) is arranged on one lead frame. A first lead part (33) is arranged under a first region of the first lateral surface of the body. A second lead part (43) is arranged under a second region of the first lateral surface of the body. |
