METHOD OF FABRICATING THREE DIMENSIONAL INTEGRATED CIRCUIT

摘要

PURPOSE: A method for fabricating a three dimensional integrated circuit is provided to improve performance by laminating each wafer die on the uppermost part of a package component. CONSTITUTION: An integrated circuit die (102) is laminated on a package component. A redistribution layer (124) is formed on the first side surface of the packaging component. A holding chamber is formed in the redistribution layer. An encapsulation layer (104) is formed on the uppermost part of the packaging component. A micro bump (120) and the redistribution layer are buried in the encapsulation layer.