| 摘要 |
The present invention relates to illuminating field, especially relates to LED chip, LED and a method of manufacturing LED chip, the method of manufacturing LED chip comprises: forming a first semiconductor layer, a luminous layer and a second semiconductor layer sequentially on a substrate; forming a phosphor powder layer on the second semiconductor layer; removing a part of the phosphor powder layer and a part of the second semiconductor layer to form at least one groove which exposes a part of the second semiconductor layer; removing a part of the phosphor powder layer, a part of the second semiconductor layer, a part of the luminous layer and a part of the first semiconductor layer to form at least one unfilled corner which exposes a part of the first semiconductor layer; forming a first electrode in the unfilled corner, and forming a second electrode in the groove. In the present invention, the process of coating phosphor powder in manufacturing LED is brought into the course of LED chip manufacturing, the advantages of this procedure are simple, controllable, to improve the light extraction efficiency of LED, to save a lot of phosphor powder and to greatly reduce the cost. |
