| 发明名称 |
SEMICONDUCTOR PACKAGE SAWING APPARATUS |
| 摘要 |
<p>SEMICONDUCTOR PACKAGE SAWING APPARATUS[122] The present invention relates to a semiconductorpackage sawing apparatus that can be applied when sawing target 5 assembly of semiconductor packages are supplied in a tray method or a cassette magazine method. Fig. 1</p> |
| 申请公布号 |
SG193721(A1) |
申请公布日期 |
2013.10.30 |
| 申请号 |
SG20130016654 |
申请日期 |
2013.03.06 |
| 申请人 |
HANMI SEMICONDUCTOR, CO., LTD. |
发明人 |
LEE, YONG KOO |
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