| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for grinding a wafer capable of improving so-called sticking to the wafer to prevent occurrence of surface burning when grinding the wafer even with a grinding wheel of abrasive grains with fine grain sizes. SOLUTION: In the method for grinding the wafer, a chuck table holding the wafer on a holding surface is rotated, and the grinding wheel is rotated and fed for grinding toward the wafer in a direction perpendicular to the holding surface of the chuck table. When a grinding surface of the grinding wheel is brought into contact with the wafer held on the holding surface of the chuck table, the grinding wheel and the chuck table are relatively moved in a prescribed amount in parallel with the holding surface and positioned so that the grinding surface of the grinding wheel can pass through the center of the wafer. Afterwards, the grinding wheel is fed for grinding to an end position of grind feeding. COPYRIGHT: (C)2010,JPO&INPIT
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