发明名称 |
Light emitting diode package |
摘要 |
An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.
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申请公布号 |
US8569779(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201113209451 |
申请日期 |
2011.08.15 |
申请人 |
WANG KAI-LUN;HSU SHIH-YUAN;LIN HOU-TE;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
WANG KAI-LUN;HSU SHIH-YUAN;LIN HOU-TE |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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