发明名称 Light emitting diode package
摘要 An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.
申请公布号 US8569779(B2) 申请公布日期 2013.10.29
申请号 US201113209451 申请日期 2011.08.15
申请人 WANG KAI-LUN;HSU SHIH-YUAN;LIN HOU-TE;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 WANG KAI-LUN;HSU SHIH-YUAN;LIN HOU-TE
分类号 H01L33/00 主分类号 H01L33/00
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