| 摘要 |
PURPOSE: A cleansing solution composition is provided to absolutely remove organic material contamination layer and residual particles on a metal surface such as copper after an abrasion process and an etching process. CONSTITUTION: A cleansing solution composition comprises an organic solvent including at least one selected from quaternary ammonium salt, monoethanol amine, and hydroxylated amine; chelate solution including a mercaptane compound; a corrosion preventer including at least one selected from 5-aminotetrazole, uric acid, hydrazine, benzothiazole, benzotriazole, and 1,2,4-triazole; and pure water. A cleansing method of copper comprises a step of chemically and mechanically polishing the surface of copper and cleansing the surface of the copper by using the cleansing solution composition. [Reference numerals] (AA) Contact angle (degree); (BB) Undiluted solution; (CC) Dilute; (DD) Comparative example 1; (EE) Comparative example 2; (FF) Example 1; (GG) Comparative example 3 |
