HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A heat discharging device and a manufacturing method thereof are provided to braze a stress reducing member without decreasing a stress reducing effect. CONSTITUTION: An insulation substrate (20) has a front surface and a rear surface. A metal layer (30) is connected to the front surface of the insulation substrate. A semiconductor device (40) is connected to the surface of the metal layer by a soldering process. A stress reducing member (50) is connected to the rear surface of the insulation substrate. The stress reducing member includes a front surface, a rear surface, and one or more stress reducing spaces. A cooling device (60) is connected to the rear surface of the stress reducing member.