发明名称 |
Wiring board having through hole or non-through hole, and method for producing the same |
摘要 |
There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity.
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申请公布号 |
US8569632(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US20060580871 |
申请日期 |
2006.10.16 |
申请人 |
NAPRA CO., LTD.;SEKINE SHIGENOBU;SEKINE YURINA |
发明人 |
SEKINE SHIGENOBU;SEKINE YURINA |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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