An electronic device includes a motherboard and a heat dissipating plate. The motherboard includes a base. The base includes a number of ports and an electronic element. The heat dissipating plate includes a substrate and a number of fasteners extending out from the substrate for engaging with the number of ports of the motherboard. The substrate defines a bulging cavity for engaging with and dissipating heat from the electronic element.
申请公布号
US8570735(B2)
申请公布日期
2013.10.29
申请号
US201113081539
申请日期
2011.04.07
申请人
TANG XUE-DONG;PENG KE-HUI;WANG REN-WEN;LI PING;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD.