发明名称 |
Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting region; applying a mounting structure in the mounting region; mounting an integrated circuit die on the mounting structure; forming an encapsulation on the integrated circuit die and having an encapsulation cavity, the encapsulation cavity shaped by the mounting structure; forming a lead having a lead protrusion from the leadframe, the lead protrusion below a horizontal plane of the integrated circuit die; and removing the mounting structure for exposing the integrated circuit die.
|
申请公布号 |
US8569112(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201213425277 |
申请日期 |
2012.03.20 |
申请人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
分类号 |
H01L21/44;H01L21/48 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|