| 摘要 |
PURPOSE: A substrate processing apparatus, a substrate processing method, and a storage medium are provided to obtain a high throughput and to prevent a coating device and a developing device from being enlarged by preventing the input interval of the substrate to a carrier block and the output interval of the substrate from the carrier block to a carrier from being increased. CONSTITUTION: A first wafer moving and mounting device (51) outputs a wafer from a carrier of a load port (3A). A second wafer moving and mounting device returns the wafer to the carrier of the load port. A first buffer module temporarily loads the wafer before the wafer is transferred from the carrier to a processing block. A second buffer module temporarily loads the wafer before the wafer is returned to the carrier of the load port. The first wafer moving and mounting device transfers the wafer from the first buffer module to the processing block. |
