发明名称 Plasma processing apparatus and method for using plasma processing apparatus
摘要 The plasma processing apparatus includes: a processing container including a metal; an electromagnetic wave source outputting an electromagnetic wave; a dielectric plate facing an inner wall of the processing container and transmitting the electromagnetic wave, which is output from the electromagnetic wave source, into the processing container; and a groove formed in an inner surface of the processing container and functioning as a propagation disturbing portion. If a low frequency microwave is supplied, the propagation of a conductor surface wave can be suppressed by the groove.
申请公布号 US8568556(B2) 申请公布日期 2013.10.29
申请号 US20080663662 申请日期 2008.06.11
申请人 HIRAYAMA MASAKI;OHMI TADAHIRO;TOKYO ELECTRON LIMITED;TOHOKU UNIVERSITY 发明人 HIRAYAMA MASAKI;OHMI TADAHIRO
分类号 C23C16/00;C23F1/00;H01L21/306 主分类号 C23C16/00
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