发明名称 |
Plasma processing apparatus and method for using plasma processing apparatus |
摘要 |
The plasma processing apparatus includes: a processing container including a metal; an electromagnetic wave source outputting an electromagnetic wave; a dielectric plate facing an inner wall of the processing container and transmitting the electromagnetic wave, which is output from the electromagnetic wave source, into the processing container; and a groove formed in an inner surface of the processing container and functioning as a propagation disturbing portion. If a low frequency microwave is supplied, the propagation of a conductor surface wave can be suppressed by the groove.
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申请公布号 |
US8568556(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US20080663662 |
申请日期 |
2008.06.11 |
申请人 |
HIRAYAMA MASAKI;OHMI TADAHIRO;TOKYO ELECTRON LIMITED;TOHOKU UNIVERSITY |
发明人 |
HIRAYAMA MASAKI;OHMI TADAHIRO |
分类号 |
C23C16/00;C23F1/00;H01L21/306 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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